Desco Europe OS-C-100 DESOLDERING BRAID, ONE-STEP, 0.075'' x 100' (1.905 MM x 30.5 M)

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Desco Europe MENDA OS-C-100 DESOLDERING BRAID, ONE-STEP, 0.075'' x 100' (1.905 MM x 30.5 M)

Used in the rework and repair of printed circuit boards, computers, cell phones or other electronics
Easily remove solder from components or pads on a circuit board
Concentrated fine copper braiding utilises less length of wick for each desoldering application
Made of clean, oxide-free copper wire and tight weave enables quick “on and off” desoldering
Flux residue on board does not need to be cleaned
High SIR--conforming to Bellcore specification GR-78-CORE (TR-TSY-000078), and IPC Test Method III
To be used in conjunction with processes using RMA type no-clean fluxes; conforms to requirements of ANSI/J-STD-004, Type LO
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